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| Ultra-Low Capacitance TVS for ESD and CDE Protection PROTECTION PRODUCTS - RailClamp(R) Description RailClamp(R) TVS diodes are specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (cable discharge events), and EFT (electrical fast transients). The RClamp(R)0502BA has a typical capacitance of only 0.60pF (pin 1 to 2). This means it can be used on circuits operating in excess of 3GHz with minimal signal attenuation. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV contact discharge). Each device can be configured to protect 1 bidirectional line or two unidirectional lines. These devices are in a small SC-75 (SOT-523) package and feature a lead-free, matte tin finish. They are compatible with both lead free and SnPb assembly techniques. They are designed for use in applications where board space is at a premium. The combination of small size, low capacitance, and high level of ESD protection makes them a flexible solution for applications such as HDMI, MDDI, antenna circuits, Automatic Test Equipment, USB 2.0, and Infiniband circuits. RCLAMP0502BA Features Transient protection for high-speed data lines to IEC 61000-4-2 (ESD) 18kV (air), 12kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Protects up to two I/O lines Ultra-Low capacitance (<1pF) No insertion loss to >3.0GHz Low profile (<1mm) Low leakage current and clamping voltage Low operating voltage: 5.0V Solid-state silicon-avalanche technology Mechanical Characteristics SC-75 (SOT-523) package Lead Finish: Matte Tin Pb-Free, Halogen Free, RoHS/WEEE Compliant Molding compound flammability rating: UL 94V-0 Packaging: Tape and Reel Applications Mobile Display Digital Interface (MDDI) USB 2.0 Firewire Ports GaAs Photodetector Protection HBT Power Amp Protection Infiniband Transceiver Protection Dimensions 1.60 0.50 BSC Schematic & PIN Configuration 3 1.60 0.80 1 1.00 BSC 2 0.75 Nominal Dimensions (mm) Revision 4/19/2010 1 SC-75 3L (Top View) www.semtech.com RCLAMP0502BA PROTECTION PRODUCTS Absolute Maximum Rating R ating Peak Pulse Power (tp = 8/20s) Peak Pulse Current (tp = 8/20s) ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Op erating Temp erature Storage Temp erature Symbol Pp k IP P VESD TJ TSTG Value 125 5 18 12 -55 to +125 -55 to +150 Units Watts A kV C C Electrical Characteristics (T=25oC) Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Symbol VRWM V BR Conditions Pin 1 or Pin 2 to Pin 3 and Between Pins 1 and 2 It = 1mA Pin 1 or Pin 2 to Pin 3 and Between Pins 1 and 2 VRWM = 5V, T=25C Pin 1 or Pin 2 to Pin 3 and Between Pins 1 and 2 IPP = 1A, tp = 8/20s Pi n 1 to Pi n 2 IPP = 5A, tp = 8/20s Pin 1 or Pin 2 to Pin 3 IPP = 5A, tp = 8/20s Pi n 1 to Pi n 2 VR = 0V, f = 1MHz Pi n 1 to Pi n 2 VR = 0V, f = 1MHz Pin 1 or Pin 2 to Pin 3 Minimum Typical Maximum 5 Units V V 6 Reverse Leakage Current IR 1 A Clamping Voltage Clamping Voltage Clamping Voltage VC VC VC 15 22 25 0.60 0.9 1.2 V V V pF pF Junction Capacitance Junction Capacitance Cj Cj (c) 2010 Semtech Corp. 2 www.semtech.com RCLAMP0502BA PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 10 110 100 90 80 70 60 50 40 30 20 10 0 Power Derating Curve Peak Pulse Power - PPP (kW) 1 0.1 0.01 0.1 1 10 Pulse Duration - tp (s) 100 1000 % of Rated Power or IPP 0 25 50 75 100 125 150 Ambient Temperature - TA (oC) Clamping Voltage vs. Peak Pulse Current Pin 1 to Pin 2 25 Clamping Voltage vs. Peak Pulse Current Pin 1 or Pin 2 to Pin 3 20 18 Clamping Voltage - VC (V) Clamping Voltage - VC (V) 20 16 14 12 10 8 6 4 2 0 Waveform Parameters: tr = 8s td = 20s 0 1 2 3 4 5 6 15 10 Waveform Parameters: tr = 8s td = 20s 0 1 2 3 4 5 6 5 0 Peak Pulse Current - IPP (A) Peak Pulse Current - IPP (A) Normalized Capacitance vs. Reverse Voltage Pin 1 or Pin 2 to Pin 3 1.4 1.2 CJ(VR) / CJ(VR=0) Normalized Capacitance vs. Reverse Voltage Pin 1 to Pin 2 1.2 f = 1 MHz 1 CJ(VR) / CJ(VR=0) 1 0.8 0.6 0.4 0.2 0.8 0.6 0.4 f = 1 MHz 0 0 1 2 3 Reverse Voltage - VR (V) 4 5 0.2 0 1 2 3 Reverse Voltage - VR (V) 4 5 (c) 2010 Semtech Corp. 3 www.semtech.com RCLAMP0502BA PROTECTION PRODUCTS Typical Characteristics Insertion Loss S21 (Pin 1 to Pin 2) CH1 S21 LOG 6 dB / REF 0 dB 1: .03430 dB 900 MHz 2: .07870 dB 1.8 GHz 3: .28040 dB 2.5 GHz 0 dB 1 2 1 2 Insertion Loss S21 (Pin 1 or Pin 2 to Pin 3) CH1 S21 LOG 6 dB / REF 0 dB 1: .00460 dB 900 MHz 2: .02010 dB 1.8 GHz 3: -.08180 dB 2.5 GHz 3 3 0 dB -6 dB -12 dB -18 dB -24 dB -30 dB -36 dB 1 MHz START . 030 MHz 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz -6 dB -12 dB -18 dB -24 dB -30 dB -36 dB 1 MHz START . 030 MHz 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz ESD Clamping (4kV Contact per IEC 61000-4-2) ESD Clamping (8kV Contact per IEC 61000-4-2) Note: Data is taken with a 10x attenuator Note: Data is taken with a 10x attenuator Analog Crosstalk CH1 S21 LOG 20 dB / REF 0 dB START . 030 MHz . STOP 3000 000000 MHz (c) 2010 Semtech Corp. 4 www.semtech.com RCLAMP0502BA PROTECTION PRODUCTS Applications Information Device Connection Options This device is optimized for protection of 1 line operating in excess of 3GHz. It may also be used to protect two lines operating in excess of 2.0GHz. The device is connected as follows: Protection for one line with <1pF capacitance can be achieved by connecting one data line to either pin 1 or pin 2 with the other pin connected to ground. Pin 3 is not connected. The connection to ground should be made directly to a ground plane. The path length should also be kept as short as possible to minimize parasitic inductance. Protection of two lines is achieved by connecting data lines at pins 1 & 2. Pin 3 is connected to ground. The connection to ground should be made directly to a ground plane. The path length should also be kept as short as possible to minimize parasitic inductance. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Figure 1. Pin Configuration (c) 2010 Semtech Corp. 5 www.semtech.com RCLAMP0502BA PROTECTION PRODUCTS Outline Drawing -SC-75 (SOT-523) A D e1 3 E DIM B A A1 A2 b c D E E1 e e1 L N 0 aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .023 .035 .000 .004 .023 .030 .031 .005 .012 .003 .008 .059 .063 .067 .057 .063 .069 .029 .031 .033 .039 BSC .020 BSC (.009) 3 0 8 .004 .008 0.60 0.00 0.60 0.15 0.10 1.50 1.45 0.75 0.90 0.10 0.80 0.30 0.20 1.60 1.70 1.60 1.75 0.80 0.85 1.00 BSC 0.50 BSC (0.22) 3 0 8 0.10 0.20 0.75 - E1 1 2 bxN e bbb CAB A A2 aaa C SEATING PLANE A1 C H SEE DETAIL A SEATING PLANE C 0 c L DETAIL A SIDE VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -BTO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern -SC-75 (SOT-523) X Y C DIM C P p1 G X Y Z DIMENSIONS INCHES MILLIMETERS (.055) .039 .020 .024 .016 .031 .087 (1.40) 1.00 0.50 0.60 0.40 0.80 2.20 Z G Y p1 P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. (c) 2010 Semtech Corp. 6 www.semtech.com RCLAMP0502BA PROTECTION PRODUCTS Marking Ordering Information Part Number Lead Finish Pb Free Qty per Reel 3,000 Reel Size 7 Inch P5 YW = Date Code RClamp 0502BATCT YW RailClamp and RClamp are registered marks of Semtech Corporation Tape and Reel Specification Device Orientation in Tape A0 1.85 +/-0.15 mm B0 1.85 +/-0.15 mm K0 0.87 +/-0.15 mm Tape Width B, (Max) D 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) D1 ( M IN ) E 1.750.10 mm (.069.004) F K (MAX) P 4.00.1 mm (.157.004) P0 4.00.1 mm (.157.004) P2 T(MAX) W 8 mm 4.2 mm (.165) 1.0 mm (.039) 3.50.05 mm (.138.002) 2.4 mm (.094) 2.00.05mm (.079.002) 0.4 mm (.016) 8.3 mm (.312.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 (c) 2010 Semtech Corp. 7 www.semtech.com |
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